Press release from Business Wire
TSMC Joins SEMATECH to Accelerate Semiconductor Technology Development
<p class='bwalignc'> <i>Cooperation will focus on research and development for exploratory technologies on 20nm generation and beyond</i> </p>
Wednesday, May 11, 2011
TSMC Joins SEMATECH to Accelerate Semiconductor Technology Development06:00 EDT Wednesday, May 11, 2011
ALBANY, N.Y. & HSINCHU, Taiwan (Business Wire) -- SEMATECH, the international consortium of semiconductor manufacturers,
and TSMC (TWSE: 2330) (NYSE: TSM), a leading global semiconductor
foundry, today announced TSMC's decision to join SEMATECH as a core
member. The cooperation will focus on advanced technology development to
address some of the industry's most pressing challenges.
TSMC will join SEMATECH to collaborate on semiconductor research and
development for IC process technologies for 20nm generation and beyond,
including extreme ultra-violet (EUV) lithography, 3D interconnects,
metrology, novel materials and device structures, and to develop
critical infrastructure vital for next-generation manufacturing,
including the transition to 450 mm wafer size.
SEMATECH's strong relationships with suppliers, chip makers,
universities, and research institutes around the world are a critical
element in providing cutting-edge research and development to its
members. SEMATECH's other core members include GlobalFoundries, HP, IBM,
Intel, Samsung, UMC, and the College of Nanoscale Science and
Engineering (CNSE).
“This relationship further reflects our commitment to push the
boundaries of innovation and deliver leading-edge technology to our
customers,” said Jack Sun, vice president and CTO, Research and
Development of TSMC. “This complementary cooperation leverages
SEMATECH's collaborative approach to lead critical industry technology
transitions, with TSMC's position as an industry leader in advanced
technology development and manufacturing.”
“We're excited that this agreement expands our long-standing
relationship with TSMC and we look forward to their contributions and
technical insights from their perspective as a global leader in advanced
semiconductor technology and manufacturing,” said Dan Armbrust,
president and CEO of SEMATECH. “TSMC will be an important partner in
accelerating the progress of R&D innovations and manufacturing solutions
in leading edge technologies.”
SEMATECH manages an international network of world-leading collaborative
partners, including foundries, IDMs, fabless, packaging and assembly
companies, and material and equipment suppliers, to provide
industry-wide solutions to the challenges of chip manufacturing.
About TSMC
TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry's largest
portfolio of process-proven libraries, IPs, design tools and reference
flows. The Company's managed capacity in 2010 totaled 11.33 million
(8-inch equivalent) wafers, including capacity from two advanced 12-inch
GIGAFABs™, four eight-inch fabs, one six-inch fab, as well as TSMC's
wholly owned subsidiaries, WaferTech and TSMC China, and its joint
venture fab, SSMC. TSMC is the first foundry to provide 40nm production
capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For
more information about TSMC please visit http://www.tsmc.com.
About SEMATECH:
For over 20 years, SEMATECH® (www.sematech.org),
the international consortium of leading semiconductor manufacturers, has
set global direction, enabled flexible collaboration, and bridged
strategic R&D to manufacturing. Today, we continue accelerating the next
technology revolution with our nanoelectronics and emerging technology
partners.
SEMATECHErica McGill, 518-649-1041erica.mcgill@sematech.orgorTSMC
Acting SpokespersonElizabeth Sun, 886-3-5682085Director,
Corporate Communication Divisionelizabeth_sun@tsmc.com
