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Press release from Business Wire

KYOCERA SLC Technologies Corporation Breaks Ground on 2nd Manufacturing Facility in Kyoto, Japan

<p class='bwalignc'> <i>Expanding to meet growing demand for substrates used in smartphones and tablet PCs</i> </p>

Tuesday, May 21, 2013

KYOCERA SLC Technologies Corporation Breaks Ground on 2nd Manufacturing Facility in Kyoto, Japan

08:07 EDT Tuesday, May 21, 2013

KYOTO, Japan (Business Wire) -- Kyocera Corporation's (NYSE:KYO)(TOKYO:6971) wholly-owned subsidiary in charge of the production of high-density wiring boards for servers and network equipment, Kyocera SLC Technologies Corporation (herein "KST"), announced that on Friday, May 17 it had broken ground on a second manufacturing facility at its Kyoto Ayabe Plant (Ayabe City, Kyoto Pref., Japan) in order to further expand its business.

With the widespread implementation of LTE networks, there is an increasing demand for smaller, lower profile FC-CSP*1 substrates for use in highly functional smartphones and tablet PCs. In the new Kyoto Ayabe Plant facility, KST will manufacture FC-CSP substrates for which the compound annual growth rate is expected to exceed 30%.

With increased production in the second facility at the Kyoto Ayabe Plant, the Kyocera Group hopes to contribute to economic development and create employment opportunities in the Kyoto area while expanding its business.

 

Outline of the New Facility

     
Name   KYOCERA SLC Technologies Corporation

Kyoto Ayabe Plant, Second Facility

Location Ayabe City, Kyoto Pref. (Japan)
Facility size Building area: 12,230m2 (steel-framed, two floors, 140×84m)

Floor space: 24,260m2

Construction plan Completion: December 2013 (planned)
Start of operations Summer of 2014 (planned)
Operations Manufacture of FC-CSP (flip-chip chip scale packaging) substrates
Production   Annual production target of 20 billion yen within several years

Note: The factory building will be designed with environmental consideration in order to realize energy conservation, for example, by reducing use of electricity and water.

*1 FC-CSP (flip-chip chip scale packaging) substrates are organic packaging substrates applied as core components in application processors or baseband processors for smartphones and tablet PCs.

For more information about Kyocera SLC Technologies Corporation: http://www.kyocera-slc.co.jp/english/index.html

About KYOCERA

Kyocera Corporation (NYSE:KYO)(TOKYO:6971) (http://global.kyocera.com/), the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of fine ceramics (also known as "advanced ceramics"). By combining these engineered materials with metals and integrating them with other technologies, Kyocera has become a leading supplier of solar power generating systems, mobile phones, printers, copiers, electronic components, semiconductor packages, cutting tools and industrial ceramics. During the year ended March 31, 2013, the company's net sales totaled 1.28 trillion yen (approx. USD13.6 billion). The company is ranked #492 on Forbes magazine's 2013 "Global 2000" listing of the world's largest publicly traded companies.

KYOCERA Corporation (Japan)
Hina Morioka, +81-(0)75-604-3416
Corporate Communications
webmaster.pressgl@kyocera.jp
Fax: +81-(0)75-604-3516

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