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Lightwave Logic Inc(LWLG-Q)
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Lightwave Logic Announces Issuance of U.S. Patent for Breakthrough Chip-Scale Packaging Technique to Enable Foundry-Level Packaging of Polymer Modulators

PR Newswire - Mon Dec 12, 2022

Company Secures Patent Issuance for Previously Announced Patent Application for Ability to Fabricate Polymer Modulators Using Chip-Scale Techniques, Enabling Simplified High-Volume Manufacturing through Foundry-Level Packaging    

Read more at prnewswire.com

Provided Content: Content provided by PR Newswire. The Globe and Mail was not involved, and material was not reviewed prior to publication.

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